Ara Philipossian

Journals/Publications

• Philipossian, A. (2014). See list of 11 pubs below. See list of 11 pubs below.
• Borucki, L., Zhuang, Y., Sampurno, Y., Philipossian, A., & Kreutzer-Schneeweiss, S. (2013). Performance analysis of a novel slurry injection system for oxide chemical mechanical planarization. ECS Transactions, 52(1), 591-596.
• Changhong, W. u., Zhuang, Y., Liao, X., Jiao, Y., Sampurno, Y. A., Theng, S., Sun, F., Naman, A., & Philipossian, A. (2013). Aggressive diamond characterization and wear analysis during chemical mechanical planarization. ECS Journal of Solid State Science and Technology, 2(1), P36-P41.
• Liao, X., Zhuang, Y., Borucki, L. J., Cheng, J., Theng, S., Ashizawa, T., & Philipossian, A. (2013). Effect of pad surface micro-texture on removal rate during interlayer dielectric chemical mechanical planarization process. Japanese Journal of Applied Physics, 52(1).
• Philipossian, A., Wu, C., Zhuang, Y., Liao, X., Jiao, Y., Sampurno, Y., Theng, S., Sun, F., & Naman, A. (2013). Aggressive diamond characterization and wear analysis during chemical mechanical planarization. ECS Transactions, 52(1), 597-603.
• Jiao, Y., Liao, X., Changhong, W. u., Theng, S., Zhuang, Y., Sampurno, Y., Goldstein, M., & Philipossian, A. (2012). Tribological, thermal and kinetic attributes of 300 vs. 450 mm chemical mechanical planarization processes. Journal of the Electrochemical Society, 159(3), H255-H259.
• Jiao, Y., Liao, X., Changhong, W. u., Zhuang, Y., Sampurno, Y., Philipossian, A., Theng, S., & Goldstein, M. (2012). Tribological, thermal, and kinetic attributes of 300 vs. 450 mm chemical mechanical planarization processes. ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings, 272-277.
• Jiao, Y., Zhuang, Y., Liao, X., Borucki, L. J., Naman, A., & Philipossian, A. (2012). Effect of temperature on pad surface contact area in chemical mechanical planarization. ECS Solid State Letters, 1(2), N13-N15.
• Liao, X., Sampurno, Y., Zhuang, Y., & Philipossian, A. (2012). Effect of slurry application/injection schemes on slurry availability during chemical mechanical planarization (CMP). Electrochemical and Solid-State Letters, 15(4), H118-H122.
• Liao, X., Sampurno, Y., Zhuang, Y., Rice, A., Sudargho, F., Philipossian, A., & Wargo, C. (2012). Effect of retaining ring slot designs and polishing conditions on slurry flow dynamics at bow wave. Microelectronic Engineering, 98, 70-73.
• Rosales-Yeomans, D., Lee, H., Suzuki, T., & Philipossian, A. (2012). Effect of concentric slanted pad groove patterns on slurry flow during chemical mechanical planarization. Thin Solid Films, 520(6), 2224-2232.
• Sun, T., Zhuang, Y., Li, W., & Philipossian, A. (2012). Investigation of eccentric PVA brush behaviors in post-Cu CMP cleaning. Microelectronic Engineering, 100, 20-24.
• Duyos-Mateo, R., Gu, X., Nemoto, T., Sugawa, S., Zhuang, Y., Sampurno, Y., Philipossian, A., & Ohmi, T. (2011). Tribological and kinetical analysis of barrier metal polishing for next generation copper interconnects. ECS Transactions, 34(1), 627-632.
• Jiao, Y., Sampurno, Y. A., Zhuang, Y., Wei, X., Meled, A., & Philipossian, A. (2011). Tribological, thermal, and kinetic characterization of 300-mm copper chemical mechanical planarization process. Japanese Journal of Applied Physics, 50(5 PART 2).
• Liao, X., Sampurno, Y., Zhuang, Y., Sudargho, F., Rice, A., & Philipossian, A. (2011). Effect of slurry application/injection methods and polishing conditions on bow wave characteristics. ECS Transactions, 34(1), 659-663.