Ara Philipossian
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Emeritus Professor of Chemical and Environmental Engineering
Courses
Chem Engr Mass Transfer
CHEE 303 (Fall 2017)
Microelect Manu+Environ
CHEE 415 (Spring 2016)
CHEE 515 (Fall 2017)
CHEE 515 (Spring 2016)
ECE 415 (Fall 2017)
ECE 415 (Spring 2016)
ECE 515 (Fall 2017)
ECE 515 (Spring 2016)
MSE 515 (Fall 2017)
Practicum
CHEE 594 (Summer I 2016)
Independent Study
CHEE 599 (Spring 2020)
CHEE 599 (Spring 2019)
Research
CHEE 900 (Spring 2020)
CHEE 900 (Fall 2019)
CHEE 900 (Spring 2019)
CHEE 900 (Fall 2018)
CHEE 900 (Spring 2017)
CHEE 900 (Fall 2016)
Master's Report
CHEE 909 (Fall 2019)
CHEE 909 (Spring 2019)
CHEE 909 (Fall 2018)
Thesis
CHEE 910 (Spring 2020)
CHEE 910 (Fall 2019)
CHEE 910 (Fall 2018)
CHEE 910 (Spring 2018)
CHEE 910 (Fall 2017)
CHEE 910 (Spring 2017)
CHEE 910 (Fall 2016)
Dissertation
CHEE 920 (Spring 2020)
CHEE 920 (Fall 2019)
CHEE 920 (Spring 2019)
CHEE 920 (Fall 2018)
CHEE 920 (Spring 2018)
CHEE 920 (Spring 2017)
CHEE 920 (Fall 2016)
CHEE 920 (Spring 2016)
Selected Publications
Journals/Publications
- Philipossian, A. (2014). See list of 11 pubs below. See list of 11 pubs below.
- Borucki, L., Zhuang, Y., Sampurno, Y., Philipossian, A., & Kreutzer-Schneeweiss, S. (2013). Performance analysis of a novel slurry injection system for oxide chemical mechanical planarization. ECS Transactions, 52(1), 591-596.
- Changhong, W. u., Zhuang, Y., Liao, X., Jiao, Y., Sampurno, Y. A., Theng, S., Sun, F., Naman, A., & Philipossian, A. (2013). Aggressive diamond characterization and wear analysis during chemical mechanical planarization. ECS Journal of Solid State Science and Technology, 2(1), P36-P41.
- Liao, X., Zhuang, Y., Borucki, L. J., Cheng, J., Theng, S., Ashizawa, T., & Philipossian, A. (2013). Effect of pad surface micro-texture on removal rate during interlayer dielectric chemical mechanical planarization process. Japanese Journal of Applied Physics, 52(1).
- Philipossian, A., Wu, C., Zhuang, Y., Liao, X., Jiao, Y., Sampurno, Y., Theng, S., Sun, F., & Naman, A. (2013). Aggressive diamond characterization and wear analysis during chemical mechanical planarization. ECS Transactions, 52(1), 597-603.
- Jiao, Y., Liao, X., Changhong, W. u., Theng, S., Zhuang, Y., Sampurno, Y., Goldstein, M., & Philipossian, A. (2012). Tribological, thermal and kinetic attributes of 300 vs. 450 mm chemical mechanical planarization processes. Journal of the Electrochemical Society, 159(3), H255-H259.
- Jiao, Y., Liao, X., Changhong, W. u., Zhuang, Y., Sampurno, Y., Philipossian, A., Theng, S., & Goldstein, M. (2012). Tribological, thermal, and kinetic attributes of 300 vs. 450 mm chemical mechanical planarization processes. ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings, 272-277.
- Jiao, Y., Zhuang, Y., Liao, X., Borucki, L. J., Naman, A., & Philipossian, A. (2012). Effect of temperature on pad surface contact area in chemical mechanical planarization. ECS Solid State Letters, 1(2), N13-N15.
- Liao, X., Sampurno, Y., Zhuang, Y., & Philipossian, A. (2012). Effect of slurry application/injection schemes on slurry availability during chemical mechanical planarization (CMP). Electrochemical and Solid-State Letters, 15(4), H118-H122.
- Liao, X., Sampurno, Y., Zhuang, Y., Rice, A., Sudargho, F., Philipossian, A., & Wargo, C. (2012). Effect of retaining ring slot designs and polishing conditions on slurry flow dynamics at bow wave. Microelectronic Engineering, 98, 70-73.
- Rosales-Yeomans, D., Lee, H., Suzuki, T., & Philipossian, A. (2012). Effect of concentric slanted pad groove patterns on slurry flow during chemical mechanical planarization. Thin Solid Films, 520(6), 2224-2232.
- Sun, T., Zhuang, Y., Li, W., & Philipossian, A. (2012). Investigation of eccentric PVA brush behaviors in post-Cu CMP cleaning. Microelectronic Engineering, 100, 20-24.
- Duyos-Mateo, R., Gu, X., Nemoto, T., Sugawa, S., Zhuang, Y., Sampurno, Y., Philipossian, A., & Ohmi, T. (2011). Tribological and kinetical analysis of barrier metal polishing for next generation copper interconnects. ECS Transactions, 34(1), 627-632.
- Jiao, Y., Sampurno, Y. A., Zhuang, Y., Wei, X., Meled, A., & Philipossian, A. (2011). Tribological, thermal, and kinetic characterization of 300-mm copper chemical mechanical planarization process. Japanese Journal of Applied Physics, 50(5 PART 2).
- Liao, X., Sampurno, Y., Zhuang, Y., Sudargho, F., Rice, A., & Philipossian, A. (2011). Effect of slurry application/injection methods and polishing conditions on bow wave characteristics. ECS Transactions, 34(1), 659-663.